晶闸管模块/整流管模块 特点 Features 芯片与底板电气绝缘,2500V交流电压 The chip and base-board areelectric-insulation, 2500V AC voltage 芯片与底板电气绝缘,2500V交流电压 Packing with international standard 全压接结构,优良的温度特 性和功率循环能力 Completely press-connection structure, with super temperatureproperties and power-cycling capability 200A以下模块皆为强迫风冷,300A以上模块,既可选用风冷,也可选用水冷 The module below 200A areall forced wind-cooling, the module above 300A could select windcooling or water-cooling for use. 安装简单,使用维修方便 Theinstallation,use as well as maintenance are simple 体积小,重量轻 Smallvolume and light weight 　　 典型应用 Typical-application 逆变器 Contravariant device 感应加热 Induction heating 斩波器 Chopper 　　说明 Instruction VDSM/VRSM=VDRM/VRRM+200V VDSM/VRSM=VDRM/VRRM+200V 除非另作说明,IGT、VGT、IH、VTM、VFM、Viso均为25℃下的测试值。表中其它参数皆为Tjm下的测试值。 Onlyif proved separately, theIGT、VGT、IH、VTM、VFM、Viso are the 　testedvalue below 25℃, other parameters inside form all are the testedvalue below Tjm I2t=I2TSMtw/2;式中tw:正弦半波电流底宽　在50Hz频率下,I2t(10ms)=0.005I2TSM(A2S) I2t=I2TSMtw/2;式中tw:正弦半波电流底宽thetw inside equation is sine semi-wave current base-width, in thecase of 50Hz, 当使用在频率为60Hz情况下,　 If used in the case of frequencybelow 60Hz, ITSM(8.3ms)=1.066ITSM(10ms),I2t(8.3ms)=0.943I2t(10ms)ITSM(8.3ms)=1.066ITSM(10ms),I2t(8.3ms)=0.943I2t(10ms)